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2010 IEEE 14th Workshop on Signal Propagation on Interconnects (SPI 2010) (2010)
Hildesheim
May 9, 2010 to May 12, 2010
ISBN: 978-1-4244-7611-4
TABLE OF CONTENTS

Effect of mixed-reference planes on single-ended and differential links in multilayer substrates (Abstract)

Sebastian Muller , Institut für Theoretische Elektrotechnik, Technische Universität Hamburg-Harburg, Germany
Renato Rimolo-Donadio , Institut für Theoretische Elektrotechnik, Technische Universität Hamburg-Harburg, Germany
Miroslav Kotzev , Institut für Theoretische Elektrotechnik, Technische Universität Hamburg-Harburg, Germany
Heinz-Dietrich Bruns , Institut für Theoretische Elektrotechnik, Technische Universität Hamburg-Harburg, Germany
Christian Schuster , Institut für Theoretische Elektrotechnik, Technische Universität Hamburg-Harburg, Germany
pp. 27-30

Characterization and modeling of RF substrate coupling effects due to vertical interconnects in 3D integrated circuit stacking (Abstract)

E. Eid , Université de Savoie, IMEP-LAHC, UMR CNRS 5130, 73376 Le Bourget du Lac Cedex, France
T. Lacrevaz , Université de Savoie, IMEP-LAHC, UMR CNRS 5130, 73376 Le Bourget du Lac Cedex, France
C. Bermond , Université de Savoie, IMEP-LAHC, UMR CNRS 5130, 73376 Le Bourget du Lac Cedex, France
S. de Rivaz , Université de Savoie, IMEP-LAHC, UMR CNRS 5130, 73376 Le Bourget du Lac Cedex, France
S. Capraro , Université de Savoie, IMEP-LAHC, UMR CNRS 5130, 73376 Le Bourget du Lac Cedex, France
J. Roullard , Université de Savoie, IMEP-LAHC, UMR CNRS 5130, 73376 Le Bourget du Lac Cedex, France
L. Cadix , Université de Savoie, IMEP-LAHC, UMR CNRS 5130, 73376 Le Bourget du Lac Cedex, France
B. Flechet , Université de Savoie, IMEP-LAHC, UMR CNRS 5130, 73376 Le Bourget du Lac Cedex, France
A. Farcy , STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles, France
P. Ancey , STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles, France
F. Calmon , Institut des Nanotechnologies de Lyon, INSA, UMR CNRS 5270, 69621 Villeurbanne, France
O. Valorge , Institut des Nanotechnologies de Lyon, INSA, UMR CNRS 5270, 69621 Villeurbanne, France
P. Leduc , CEA-LETI, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France
pp. 35-38

Multiport measurement and deembedding techniques for crosstalk study in via arrays (Abstract)

Miroslav Kotzev , Institut für Theoretische Elektrotechnik, Technische Universität Hamburg-Harburg, Deutschland Harburger Schloßstr. 20, 21079 Hamburg, Germany
Renato Rimolo-Donadio , Institut für Theoretische Elektrotechnik, Technische Universität Hamburg-Harburg, Deutschland Harburger Schloßstr. 20, 21079 Hamburg, Germany
Heinz-Dietrich Bruns , Institut für Theoretische Elektrotechnik, Technische Universität Hamburg-Harburg, Deutschland Harburger Schloßstr. 20, 21079 Hamburg, Germany
Christian Schuster , Institut für Theoretische Elektrotechnik, Technische Universität Hamburg-Harburg, Deutschland Harburger Schloßstr. 20, 21079 Hamburg, Germany
pp. 47-50

Modeling the ion-exchange process to support the manufacturing of optical multimode graded-index waveguides in thin glass sheets (Abstract)

Thomas Kuhler , University of Siegen, Theoretical Electrical Engineering and Photonics, Hölderlinstraße 3, D-57068 Siegen/Germany
Elmar Griese , University of Siegen, Theoretical Electrical Engineering and Photonics, Hölderlinstraße 3, D-57068 Siegen/Germany
pp. 87-89

Nearfield-immunity scan on printed circuit board level (Abstract)

Oliver Kroning , Otto-von-Guericke-University Magdeburg, Chair of Theoretical Electrical Engineering, Magdeburg, Germany
Mario Krause , Otto-von-Guericke-University Magdeburg, Chair of Theoretical Electrical Engineering, Magdeburg, Germany
Marco Leone , Otto-von-Guericke-University Magdeburg, Chair of Theoretical Electrical Engineering, Magdeburg, Germany
pp. 101-102

Step response sensitivity to selected parameters of VLSI inverter — interconnect -inverter system (Abstract)

Agnieszka Wardzinska , Chair of Multimedia Telecommunications and Microelectronics, Poznan, University of Technology
Wojciech Bandurski , Chair of Multimedia Telecommunications and Microelectronics, Poznan, University of Technology
pp. 133-136
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