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Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
Santa Cruz, CA, USA
Jan. 31, 1995 to Feb. 2, 1995
ISBN: 0-8186-6970-5
TABLE OF CONTENTS

Fault isolation and performance characterization of high speed digital multichip modules (PDF)

D.C. Keezer , Center for Microelectron. Res., Univ. of South Florida, Tampa, FL, USA
pp. 26-31

An MCM-D memory module in an overmolded plastic package (PDF)

A. Bet-Shliemoun , MicroModule Syst., Cupertino, CA, USA
Nien-Tsu Shen , MicroModule Syst., Cupertino, CA, USA
pp. 34-39

The design and implementation of NASA's advanced flight computing module (PDF)

L. Alkalaj , Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
pp. 40-44

Field programmable multi-chip module (FPMCM)-an integration of FPGA and MCM technology (PDF)

J. Darnauer , Dept. of Comput. Eng., Univ. Coll. Santa Cruz, CA, USA
T. Isshiki , Dept. of Comput. Eng., Univ. Coll. Santa Cruz, CA, USA
P. Garay , Dept. of Comput. Eng., Univ. Coll. Santa Cruz, CA, USA
J. Ramirez , Dept. of Comput. Eng., Univ. Coll. Santa Cruz, CA, USA
V. Maheshwari , Dept. of Comput. Eng., Univ. Coll. Santa Cruz, CA, USA
W.W. Tai , Dept. of Comput. Eng., Univ. Coll. Santa Cruz, CA, USA
pp. 50-55

Design considerations for implementing a modularly configured attached processor in a multi chip module (PDF)

J.S. Singh , Dept. of Electr. & Comput. Eng., Texas Univ., El Paso, TX, USA
B.W. Gremel , Dept. of Electr. & Comput. Eng., Texas Univ., El Paso, TX, USA
V.P. Singh , Dept. of Electr. & Comput. Eng., Texas Univ., El Paso, TX, USA
G.A. Gibson , Dept. of Electr. & Comput. Eng., Texas Univ., El Paso, TX, USA
pp. 62-68

Electrical and thermal study of membrane multi-chip module systems (PDF)

Wheling Cheng , Center for Integrated Syst., Stanford Univ., CA, USA
S.S. Wong , Center for Integrated Syst., Stanford Univ., CA, USA
pp. 69-74

Thermosonic bonding for flip-chip assembly (PDF)

Sa Yoon Kang , Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA
pp. 75-80

Inductance calculations for MCM system design and simulation (PDF)

N. Klemmer , SICAN Forschungs- und Entwicklungsbetriebsgesellschaft mbH, Hannover, Germany
pp. 81-86

Sensitivity analysis of interconnect networks based on S-parameter macromodel (PDF)

Yanhua Sun , Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
Wayne Wei-Ming Dai , Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
pp. 87-92

Electromagnetic modeling and transient simulation of interconnects in high speed VLSI (PDF)

Zhen-Hai Zhu , Dept. of Radio Eng., Southeast Univ., Nanjing, China
Wei Hong , Dept. of Radio Eng., Southeast Univ., Nanjing, China
Yiyuan Chen , Dept. of Radio Eng., Southeast Univ., Nanjing, China
Yunyi Wang , Dept. of Radio Eng., Southeast Univ., Nanjing, China
Jin Tao , Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 93-98

An automatic network generator for design verification of electronic packages (PDF)

N. Cherukuri , Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
J.L. Prince , Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 99-104

Two-pole analysis of interconnection trees (PDF)

A.B. Kahng , Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
S. Muddu , Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
pp. 105-110

Avoiding dispersion in distributed RLC lines by shaping (PDF)

J.S. Roychowdhury , AT&T Bell Labs., Allentown, PA, USA
pp. 111-116

Comparisons of bus transfer operations using PPS (pulsed power supply) and conventional CMOS in PWB and MCM environments (PDF)

T. Gabara , AT&T Bell Labs., Murray Hill, NJ, USA
B. Fischer , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 118-122

Wire width optimization of transmission lines for low power design (PDF)

R. Gupta , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
J. Willis , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
L.T. Pillage , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 123-129

Design of mixed signal MCM-Ds using silicon circuit boards (PDF)

C.R. Hodges , nCHIP Inc., San Jose, CA, USA
D. Benson , nCHIP Inc., San Jose, CA, USA
K. Huey , nCHIP Inc., San Jose, CA, USA
pp. 130-135

System design optimization for MCM (PDF)

P.D. Franzon , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
A. Stanaski , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Y. Tekmen , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
S. Banerjai , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 138-143

Impact of packaging technology on system partitioning: a case study (PDF)

P. Dehkordi , Tennessee Univ., Knoxville, TN, USA
K. Ramamurthi , Tennessee Univ., Knoxville, TN, USA
D. Bouldin , Tennessee Univ., Knoxville, TN, USA
pp. 144-149

Efficient modeling and simulation of coupled transmission lines (PDF)

E.C. Chang , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Sung-Mo Kang , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 152-157

Moment models of general transmission lines with application to MCM interconnect analysis (PDF)

Qingjian Yu , Electron. Res. Lab., UC Berkeley, CA, USA
E.S. Kuh , Electron. Res. Lab., UC Berkeley, CA, USA
pp. 158-163

Optimal transient simulation of distributed lines (PDF)

D. Kuznetsov , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
J.E. Schutt-Aine , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
R. Mittra , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 164-169

A novel low cost MCM-D technology (PDF)

A.M. Almeida , Res. & Dev. Cente, Telecomunicacoes Brasileiras SA, Campinas, Brazil
M. Barnett , Res. & Dev. Cente, Telecomunicacoes Brasileiras SA, Campinas, Brazil
C.A. Finardi , Res. & Dev. Cente, Telecomunicacoes Brasileiras SA, Campinas, Brazil
A. Flacker , Res. & Dev. Cente, Telecomunicacoes Brasileiras SA, Campinas, Brazil
A.C. Gozzi , Res. & Dev. Cente, Telecomunicacoes Brasileiras SA, Campinas, Brazil
J.P. Molina , Res. & Dev. Cente, Telecomunicacoes Brasileiras SA, Campinas, Brazil
A.C. Pagotto , Res. & Dev. Cente, Telecomunicacoes Brasileiras SA, Campinas, Brazil
M.F. Santos , Res. & Dev. Cente, Telecomunicacoes Brasileiras SA, Campinas, Brazil
pp. 172-176

Design and characterization of three-dimensional aluminum nitride multichip modules (PDF)

S.L. Palmquist , Solid State Electron. Center, Honeywell Inc., Plymouth, MN, USA
R.J. Jensen , Solid State Electron. Center, Honeywell Inc., Plymouth, MN, USA
W.F. Jacobsen , Solid State Electron. Center, Honeywell Inc., Plymouth, MN, USA
R.K. Spielberger , Solid State Electron. Center, Honeywell Inc., Plymouth, MN, USA
pp. 177-182

Efficient smart substrates with test capabilities and on-line temperature monitoring (PDF)

H. Werkmann , Inst. for Microelectron., Stuttgart, Germany
B. Laquai , Inst. for Microelectron., Stuttgart, Germany
T. Schwederski , Inst. for Microelectron., Stuttgart, Germany
pp. 183-188

Micro heat spreader enhanced heat transfer in MCMs (PDF)

D.S. Shen , Sandia Nat. Labs., Albuquerque, NM, USA
R.T. Mitchell , Sandia Nat. Labs., Albuquerque, NM, USA
D. Dobranich , Sandia Nat. Labs., Albuquerque, NM, USA
D.R. Adkins , Sandia Nat. Labs., Albuquerque, NM, USA
M.R. Tuck , Sandia Nat. Labs., Albuquerque, NM, USA
pp. 189-194

Application of capacitive coupling to switch fabrics (PDF)

D. Salzman , Polychip Inc., Washington, DC, USA
T. Knight , Polychip Inc., Washington, DC, USA
P. Franzon , Polychip Inc., Washington, DC, USA
pp. 195-199

A low-cost MCM design topology-the interconnected mesh power system (IMPS) (PDF)

Y.L. Low , HiDEC, Arkansas Univ., Fayetteville, AR, USA
L.W. Schaper , HiDEC, Arkansas Univ., Fayetteville, AR, USA
S.S. Ang , HiDEC, Arkansas Univ., Fayetteville, AR, USA
pp. 200-205

High temperature Cu-Sn joints manufactured by a 250/spl deg/C fluxless bonding process (PDF)

Yi-Chia Chen , Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
S.J. Lee , Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
C.C. Lee , Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
pp. 206-211

Cost effective small via generation-the laser solution (PDF)

Bo Gu , Lumonics Inc., Kanata, Ont., Canada
J.M. Morrison , Lumonics Inc., Kanata, Ont., Canada
pp. 212-216

Experimental characterization of simultaneous switching noise for multichip module (PDF)

K. Ito , Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan
K. Kato , Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan
N. Hirano , Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan
T. Sudo , Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan
pp. 217-220

A unified approach to chip, test, and assembly technologies for MCMs (PDF)

D.J. Bartelink , Hewlett-Packard Co., Palo Alto, CA, USA
pp. 221-228

Examination of high frequency dielectric properties of thin film polymers using an in-situ resonant technique (PDF)

K.G. Laursen , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
D. Hertling , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 229-231

Author index (PDF)

pp. 232
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