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Proceedings of IEEE Multi-Chip Module Conference (MCMC-94) (1994)
Santa Cruz, CA, USA
March 15, 1994 to March 17, 1994
ISBN: 0-8186-5560-7
TABLE OF CONTENTS

Yield-based system partitioning strategies for MCM and ASEM design (PDF)

S. Khan , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
V. Madisetti , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 144-149

Partitioning of opto-electronic multichip modules (PDF)

J. Fan , Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
B. Catanzaro , Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 138-143

Crosstalk in coupled interconnects with meshed ground planes (PDF)

Sifen Luo , Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Jyh-Ming Jang , Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
V.K. Tripathi , Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
pp. 132-137

Modeling of Delta-I noise in digital electronics packaging (PDF)

Yuzhe Chen , Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
Zhonghua Wu , Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
pp. 126-131

Integrating subnetworks characterized by measured data into moment-matching simulations (PDF)

R. Sanaie , Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
E. Chiprout , Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
M.S. Nakhla , Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
Q.J. Zhang , Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
pp. 114-119

A pragmatic test and diagnosis methodology for partially testable MCMs (PDF)

M. Lubaszewski , TIMA, Inst. Nat. Polytech. de Grenoble, France
M. Marzouki , TIMA, Inst. Nat. Polytech. de Grenoble, France
M.H. Touati , TIMA, Inst. Nat. Polytech. de Grenoble, France
pp. 108-113

Are there any alternatives to "known good die" ? /spl lsqb/MCMs/spl rsqb/ (PDF)

A.E. Gattiker , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
W. Maly , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 102-107

Capacitive coupling solves the known good die problem (PDF)

D. Saltzman , Polychip Inc., Cambridge, MA, USA
T. Knight , Polychip Inc., Cambridge, MA, USA
pp. 95-100

Silicon microprobing array for testing and burn-in (PDF)

T. Hirano , Tokyo Res. Lab., IBM Res., Kanagawa, Japan
pp. 89-94

Latent open testing of electronic packaging (PDF)

A. Halperin , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
T.H. DiStefano , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Shinwu Chiang , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 83-88

Advanced TAB/BGA multi-chip stacked module for high density LSI packages (PDF)

M. Mita , Dept. of Electron. Mater. Eng., Hitachi Cable Ltd., Densen, Japan
T. Kumakura , Dept. of Electron. Mater. Eng., Hitachi Cable Ltd., Densen, Japan
pp. 68-76

Laminated memory: a new 3-dimensional packaging technology for MCMs (PDF)

R. Hsu , nChip Inc., San Hose, CA, USA
D.B. Tuckerman , nChip Inc., San Hose, CA, USA
N.E. Brathwaite , nChip Inc., San Hose, CA, USA
J. Demmin , nChip Inc., San Hose, CA, USA
K. Flatow , nChip Inc., San Hose, CA, USA
L.-O. Bauer , nChip Inc., San Hose, CA, USA
P. Kim , nChip Inc., San Hose, CA, USA
C.-M. Lin , nChip Inc., San Hose, CA, USA
K. Lin , nChip Inc., San Hose, CA, USA
S. Nguyen , nChip Inc., San Hose, CA, USA
V. Thipphavong , nChip Inc., San Hose, CA, USA
pp. 58-63

Applications and design techniques for MCMs (PDF)

E.E. Davidson , IBM Corp., Poughkeepsie, NY, USA
pp. 50-57

Application specific electronic modules (ASEM) CAD/CAE/CAM interface specification alliance (PDF)

K. Drake , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
M. Abadir , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
S. Stark , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
T. Rhyne , Microelectron. & Comput. Technol. Corp., Austin, TX, USA
pp. 44-49

Fast pad redistribution from periphery-IO to area-IO (PDF)

J. Darnauer , Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
W.W.-M. Dai , Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
pp. 38-43

Characterization of net configurations for multichip modules (PDF)

T. Okada , Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan
T. Sudo , Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan
pp. 32-37

Clocking considerations for a Pentium-based CPU module with 512K byte secondary cache (PDF)

R.M. Reinschmidt , MicroModule Syst., Cupertino, CA, USA
D.H. Leuthold , MicroModule Syst., Cupertino, CA, USA
pp. 26-31

A multi-chip module implementation of a neural network (PDF)

M.G. Stout , Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
L.G. Salmon , Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 20-25

A 27 mW CMOS RF oscillator operating at 1.2 GHz (PDF)

T. Gabara , AT&T Bell Labs., Murray Hill, NJ, USA
K. Tai , AT&T Bell Labs., Murray Hill, NJ, USA
M. Lau , AT&T Bell Labs., Murray Hill, NJ, USA
Shin Pei , AT&T Bell Labs., Murray Hill, NJ, USA
R. Frye , AT&T Bell Labs., Murray Hill, NJ, USA
P. Sullivan , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 15-19

High performance MCM-D technology (PDF)

S. Kikuchi , Fujitsu Labs. Ltd., Kawasaki, Japan
H. Yamamoto , Fujitsu Labs. Ltd., Kawasaki, Japan
K. Seyama , Fujitsu Labs. Ltd., Kawasaki, Japan
M. Hirano , Fujitsu Labs. Ltd., Kawasaki, Japan
K. Moriizumi , Fujitsu Labs. Ltd., Kawasaki, Japan
pp. 9-14

IBM ARPA ASEM foundry (PDF)

Y.-M. Ting , IBM Federal Systems Co.
pp. 8

Large scale multimedia and interactive television (PDF)

B.E. Willner , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 1
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