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Proceedings of IEEE Multi-Chip Module Conference (MCMC-93) (1993)
Santa Cruz, CA, USA
May 15, 1993 to May 18, 1993
ISBN: 0-8186-3540-1
TABLE OF CONTENTS

Physical layout algorithms for computer generated holograms in optoelectronic MCM systems design (PDF)

J. Fan , California Univ., San Diego, La Jolla, CA, USA
D. Zaleta , California Univ., San Diego, La Jolla, CA, USA
C.K. Cheng , California Univ., San Diego, La Jolla, CA, USA
S.H. Lee , California Univ., San Diego, La Jolla, CA, USA
pp. 198-203

A distributed-RCL model for MCM layout (PDF)

D. Zhou , Dept. of Electr. Eng., North Carolina Univ., Charlotte, NC, USA
F. Tsui , Dept. of Electr. Eng., North Carolina Univ., Charlotte, NC, USA
pp. 191-197

Automatic a-priori generation of delay and noise macromodels and wiring rules for MCMs (PDF)

P. Franzon , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
S. Simovich , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
S. Mehrotra , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
M. Steer , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 185-190

A fast four-via multilayer MCM router (PDF)

K.-Y. Khoo , Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
J. Cong , Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
pp. 179-184

Cost-driven layout for thin-film MCMs (PDF)

W.W.-M. Dai , Board of Studies in Comput. Eng., California Univ., Santa Cruz, CA, USA
D. Staepelaere , Board of Studies in Comput. Eng., California Univ., Santa Cruz, CA, USA
J. Jue , Board of Studies in Comput. Eng., California Univ., Santa Cruz, CA, USA
T. Dayan , Board of Studies in Comput. Eng., California Univ., Santa Cruz, CA, USA
pp. 174-178

iPROMIS: an interactive performance driven multilayer MCM router (PDF)

M. Sriram , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
S.M. Kang , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 170-173

Timing-driven system partitioning by constraints decoupling method (PDF)

M. Shih , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
E.S. Kuh , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 164-169

Yield analysis and optimization of VLSI interconnects in multichip modules (PDF)

Q.J. Zhang , Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
M. Nakhla , Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
pp. 160-163

Design for packageability-the impact of bonding technology on the size and layout of VLSI dies (PDF)

P. Dehkordi , Dept. of Electr. & Comput. Eng., Tennessee Univ., Knoxville, TN, USA
D.W. Bouldin , Dept. of Electr. & Comput. Eng., Tennessee Univ., Knoxville, TN, USA
pp. 153-159

An I/O CMOS buffer set for silicon multichip module's (MCM) (PDF)

T. Gabara , AT&T Bell Labs., Murray Hill, NJ, USA
W. Fischer , AT&T Bell Labs., Murray Hill, NJ, USA
S. Knauer , AT&T Bell Labs., Murray Hill, NJ, USA
R. Frye , AT&T Bell Labs., Murray Hill, NJ, USA
K. Tai , AT&T Bell Labs., Murray Hill, NJ, USA
M. Lau , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 147-152

Transient waveform estimation of high-speed MCM networks using complex frequency hopping (PDF)

E. Chiprout , Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
M. Nakhla , Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
pp. 134-139

Wave spreading evaluation of interconnect systems (PDF)

H. Liao , Board of Studies in Comput. Eng., California Univ., Santa Cruz, CA, USA
W.W.-M. Dai , Board of Studies in Comput. Eng., California Univ., Santa Cruz, CA, USA
pp. 128-133

FDTD modeling of noise in computer packages (PDF)

W.D. Becker , IBM East Fishkill, NY, USA
pp. 123-127

A broad band loss model for MCM interconnections (PDF)

J. Peeters , IMEC, Leuven, Belgium
E. Beyne , IMEC, Leuven, Belgium
pp. 111-116

Test vehicle for MCM-D interconnect process development (PDF)

S. Westbrook , MicroModule Systems, Cupertino, CA, USA
pp. 106-110

Reliability by design for MCM manufacturing the roadmap and an example (PDF)

N.-T. Shen , MicroModule Systems Inc., Cupertino, CA, USA
pp. 100-105

A quasi-static analysis of fuzz button interconnects (PDF)

G. Pan , Dept. of Electr. Eng. & Comput. Sci., Wisconsin Univ., Milwaukee, WI, USA
X. Zhu , Dept. of Electr. Eng. & Comput. Sci., Wisconsin Univ., Milwaukee, WI, USA
B. Gilbert , Dept. of Electr. Eng. & Comput. Sci., Wisconsin Univ., Milwaukee, WI, USA
pp. 85-91

Integral decoupling capacitance reduces multichip module ground bounce (PDF)

T. Takken , Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 79-84

The pretreatment of aluminum bondpads for electroless nickel bumping (PDF)

A. Ostmann , Tech. Univ. Berlin, Germany
J. Simon , Tech. Univ. Berlin, Germany
H. Reichl , Tech. Univ. Berlin, Germany
pp. 74-78

Membrane multichip module technology on silicon (PDF)

W. Cheng , Stanford Univ., CA, USA
M.A. Beiley , Stanford Univ., CA, USA
S.S. Wong , Stanford Univ., CA, USA
pp. 69-73

Electron-beam MCM substrate tester (PDF)

M. Brunner , Siemens Corp. Res., Munich, Germany
R. Schmid , Siemens Corp. Res., Munich, Germany
pp. 62-68

Development of the RIT infrastructure for design, fabrication and testing of small multichip modules (PDF)

P.R. Mukund , Rochester Inst. of Technol., NY, USA
R.E. Pearson , Rochester Inst. of Technol., NY, USA
pp. 58-60

End users access to prototype and production MCMs (PDF)

G.A. Forman , GE Corp. Res., Schenectady, NY, USA
C.A. Becker , GE Corp. Res., Schenectady, NY, USA
pp. 52-57

Implementation of a MCM brokerage service (PDF)

C.A. Pina , Univ. of Southern California, Los Angeles, CA, USA
pp. 46-51

Developing a merchant MCM infrastructure (PDF)

N.J. Naclerio , Defense Adv. Res. Proj. Agency Arlington, VA, USA
pp. 45

A multichip module design for portable video compression systems (PDF)

C.-F. Chang , Dept. of Electr. Eng. Univ. of Southern California, Los Angeles, CA, USA
B.J. Sheu , Dept. of Electr. Eng. Univ. of Southern California, Los Angeles, CA, USA
pp. 39-44

High density overlay interconnect (HDI) delivers high frequency performance for GaAs systems (PDF)

M. Gdula , GE Corp. Res. & Dev. Center, Schenectady, NY, USA
T. Haller , GE Corp. Res. & Dev. Center, Schenectady, NY, USA
V. Krishnamurthy , GE Corp. Res. & Dev. Center, Schenectady, NY, USA
G. Forman , GE Corp. Res. & Dev. Center, Schenectady, NY, USA
pp. 33-38

SuperSPARC multichip module (PDF)

D. Brady , Texas Instruments Inc., Stafford, TX, USA
A. Mehta , Texas Instruments Inc., Stafford, TX, USA
K. Johnson , Texas Instruments Inc., Stafford, TX, USA
F. Cano , Texas Instruments Inc., Stafford, TX, USA
D. Anderson , Texas Instruments Inc., Stafford, TX, USA
D. Chong , Texas Instruments Inc., Stafford, TX, USA
G. Hamilton , Texas Instruments Inc., Stafford, TX, USA
J. Kennedy , Texas Instruments Inc., Stafford, TX, USA
M. Murtuza , Texas Instruments Inc., Stafford, TX, USA
P. Hundt , Texas Instruments Inc., Stafford, TX, USA
N. Hong , Texas Instruments Inc., Stafford, TX, USA
F. Valente , Texas Instruments Inc., Stafford, TX, USA
pp. 19-28

Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologies (PDF)

A. Iqbal , IBM Corp., Hopewell Junction, NY, USA
M. Swaminathan , IBM Corp., Hopewell Junction, NY, USA
M. Nealon , IBM Corp., Hopewell Junction, NY, USA
A. Omer , IBM Corp., Hopewell Junction, NY, USA
pp. 12-17

MCMs for portable applications (PDF)

W.B. Baringer , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
R.W. Brodersen , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 1-5
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